設(shè)備名稱 Equipment Name

槽式RCA清洗設(shè)備 Batch-type RCA Cleaning Equipment

設(shè)備型號 Equipment Model

SC-CSZJ9600E-20F

設(shè)備用途 Equipment Application

用于擴散后的硅片去繞鍍、清洗處理。

Used for wrap around removal & cleaning of the diffused silicon wafers.

工藝流程 Process Flow

去繞鍍→后清洗→酸洗→后清洗→酸洗→預脫水→烘干 （供參考）  

Wrap Around Removal → Post-clean→ Acid Clean → Post-clean→Acid Clean→ Hot Water Drying → Drying (for reference)

技術(shù)特點  Features

1、產(chǎn)能：400片/批，9600片/小時（210硅片）,480片/批，12000片/小時（182硅片）。

Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).

2、支持多種添加劑技術(shù)。

Various additive technologies available.

3、支持最薄120μm硅片。

Wafer thickness down to 120μm.

4、潔凈區(qū)域干燥，自潔凈系統(tǒng)。

With dry clean area and self-cleaning system.

5、快速換液，在線換液。

Quick inline bath change.

6、支持MES、RFID及選配在線稱重功能。

Available with MES, RFID system, inline weight testing optional.

設(shè)備參數(shù) Parameters